STI Electronics Engineering Services Division to Exhibit at the Defense Manufacturing Conference

Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT).

The Engineering Services division is a multifaceted technical organization that provides engineering support in the field of electronics manufacturing. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full service design review and pre-production facility.