Analysis
SP Devices interleaving technology used in Texas Instruments’ new 12-bit ADC evaluation module
SP Devices today introduced its second evaluation module (EVM) with Texas Instruments (TI). This new EVM combines TI's fastest 12-bit analog-to-digital converters (ADCs) in an interleaved fashion with a Xilinx Virtex-5 FPGA to create the best-performing high-speed digitizer solution in the market. The FPGA comes pre-installed with SP Devices' proprietary time-interleaving technology to eliminate interleaving spurs, which enhances performance and facilitates rapid system-level evaluation for wireless communications, military, test and measurement applications. The EVM joins TI's portfolio of support tools for customers using high-speed data converters in wide-bandwidth applications.
The The SP Devices' interleaving technology continuously analyzes the ADCs' outputs to automatically remove the interleaving spurs arising from gain and mismatch errors, removing the need for costly monitoring components and an off-line recalibration routine. The captured signal is then sent to a PC for further analysis. Those wishing to implement a system utilizing the interleaving technology found on the ADS54RF63-ADX4 will need to contact SP Devices in order to obtain a production license.
“It remains critical for our customers that we address the increasing demand for higher sampling speeds and extended bandwidth,” said Jonas Nilsson, CEO of SP Devices. “Combining SP Devices’ innovative interleaving technology with TI’s market-leading data converters allows us to extend the performance of high-speed ADCs. This high performance will extend to a broad range of new applications including Radio Base Stations/Multi-Carrier systems, Software-defined radio, and beyond.”