Nihon Superior will appear at NEPCON to address Soldering challenges

SN100C7A is a lead-free solder for use in applications such as power modules that have to operate at high temperatures. The high volume fraction of intermetallic particles with controlled morphology means that the material retains adequate strength at temperatures up to 200°C.

SN100C P504 D4 is a general purpose solder paste that can be used in a wide range of electronics assembly applications. This product has improved performance compared with previous products in this series making it ideal for high density fine-pitch applications. SN100C P504 D4 can usually be reflowed with a thermal profile similar to that used for the reflow of tin-silver-copper paste.

SN100C (031) is a general purpose flux-cored lead-free solder wire that offers improved productivity. The solder wire provides fast wetting, resulting in faster soldering. In addition to offering good wetting and spread, SN100C (031) features low flux spattering, high insulation resistance and fast sequential soldering.

NS-F901 is a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, allowing high topside board temperatures (up to 125°C) and long dwell times that may be required for thick boards and dense, complex assemblies, while being environmentally friendly. NS-F901 is specifically designed for use with SN100C lead-free solder but is applicable to all lead-free alloys as well as Sn-Pb in wave soldering.

In the development of SN100C P604 D4 lead-free and completely halogen-free solder paste, Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive and does not use any chemicals requiring special registration under the EU REACH legislation without compromising performance and reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.

Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effect joints to most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperature without the need for external pressure. By controlling the sintered microstructure the modulus of the joint can be tailored to accommodate strains arising from CTE differences between a die and a substrate without overstressing the die. After sintering, the melting point of the silver returns to the 961°C of bulk silver so that the joint retains its integrity at high operating temperatures. As such it is ideally suited to the attachment of power semiconductor dies that can achieve maximum efficiency at higher operating temperatures. The Alconano nano-silver pastes can be considered a Pb-free replacement for the >85% Pb solders that are currently used in this application.