Analysis

IPC Midwest Soldering Competition sponsored by Colbar

26th July 2012
ES Admin
0

Balver Zinn has today announced that Cobar Solder will be sponsoring and participating in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.

Over two days, contestants will compete to build a functional electronics assembly within a half-hour time limit. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which assembly was produced and overall electrical functionality of assembly.

In conjunction with the soldering competition, Cobar Solder will exhibit its SN100C-XF3+ lead-free solder paste and wire, which accommodate extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. Additionally, the paste exhibits a robust printing window.

SN100C- XF3+ offers better results for eliminating voiding when compared to any SAC-alloy. The paste provides improved print performance as well as long stencil life. XF3+ allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

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