SiTel single-chip DECT ICs with QSPI Flash interface deliver Flash flexibility at ROM prices

SiTel’s novel QSPI Flash interface is designed specifically for low-power applications and guarantees low current consumption. As a result, cordless phone manufacturers now have a third option for incorporating Flash memory that was previously only available to consumer electronics applications. It avoids the expensive processing of embedded Flash or the costs of external parallel Flash. This brings the cost of Flash-based systems down to a level comparable with ROM-based systems, without the long lead times associated with ROM code production.

Moreover, the QSPI interface has the advantage of allowing the use of very small packages, minimizing the amount of PCB space required and enabling the creation of compact, visually appealing end products. Available in a wide range of memory sizes – from 4 to 32 Mb – QSPI Flash chips allow manufacturers to deliver a complete product portfolio from a single base PCB design. It also eliminates the need for separate EEPROM for storing user settings and phonebooks.

“QSPI Flash memory has the potential to deliver a wide variety of benefits for cordless phone manufacturers. But, being originally developed for consumer electronics applications, it was not compatible with the lower power requirements of the cordless telephony domain. Our unique low-power QSPI interface brings the flexibility and cost savings of QSPI Flash within reach of cordless phone makers and guarantees the lowest current consumptions on the market,” said John Pol, Product Marketing Manager at SiTel.

The SC14441 and SC14442 are available for mass production now. The SC14441 is supplied in a 96-pin LLGA package. Offering extra codec and I/O functionality, the SC14442 is housed in a 113-pin LLGA package.