SEHO Systems to Highlight PowerSelective Soldering System at NEPCON China 2012

SEHO's PowerSelective features a modular design, ensuring the highest flexibility. The system offers SEHO's unique multi-nozzle technology and can be customized to meet specific production requirements. The SEHO multi-nozzle technology ensures short cycle times as low as 25 seconds per panel or carrier. With tool change on-the-fly, customers can run high-mix production without losing changeover time.

For maximum flexibility, the system features high-precision mini-wave processes that are completely independent from the fluxing and preheat process to ensure high-volume production.
Innovative software features ensure maximum reliability during the selective soldering process. The award-winning real-quantity flux monitoring system is a milestone in process control as it does not only monitor the function of the drop jet fluxer, but also the actual flux quantity which is applied to the board. The SEHO PowerSelective is featured with a fiducial recognition function for automatic PCB alignment that compensates various types of misalignment, such as offset, rotational error or linear shrinkage. The warpage compensation function automatically compensates product- or production-related warpage of the assemblies to be soldered.

SEHO’s latest innovation is the award-winning automated optical inspection system (AOI) that can be embedded directly in the selective soldering process. The system is used for the detection of soldering defects such as non-wetting or insufficient wetting, missing pin or bridging. The AOI system can be easily integrated into a SEHO PowerSelective, offering remarkable cost savings in floor space and board handling equipment.

Depending on the application, the PowerSelective may be equipped with an inline conveyor for integration into a fully automated production line or with a batch conveyor module for standalone operation. The system is capable of handling multiple boards with parallel processes. Both bare boards as well as assemblies in carriers may be processed with the PowerSelective.