The Balver Zinn Group and Cobar Europe BV Accept a 2011 Global Technology Award for Its New SCAN-Ge071-XF3+ Solder Paste

SCAN-Ge071 is a low Ag lead-free alloy. The alloy is an improved SAC alloy that contains a small amount of Ni to reduce the growth of the intermetallic layer, resulting in more reliable solder joints. The flux is an optimized resin based chemistry that provides the best wetting and printing properties with this specific alloy.



SCAN-Ge071 is designed to make printing possible up to 100 mm/s for larger volume production lines. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speed and short cycle times.



The short melting range of the SCAN-Ge071 with this unique flux chemistry will minimize/eliminate the tombstoning defects in inert reflow applications with low oxygen levels as well as in vapor phase soldering. The nickel addition contributes to a finer crystalline structure of the intermetallic. As a result, copper leaching is reduced. This low SAC alloy is known for its good drop test reliability. Additionally, the matt solder appearance will contribute to a more consistent AOI inspection and make visual inspection easier.



Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.