Analysis
RIBER and TRUMPF start collaboration on next-generation III-V high power semiconductor lasers
Riber today signed an agreement with TRUMPF to collaborate on epitaxy process technologies for next-generation III-V high power laser devices. The agreement follows a successful process qualification at the Ferdinand Braun Institut, Berlin (Germany).
In tFacet passivation process is implemented through both top-quality MBE and the capability to handle substrates for bar-based lasers. Riber's MBE412 sold to Trumpf allows for ultra high vacuum conditions and delivers processed wafers automatically and quickly.