SEHO Highlight PowerSelective With Process Control Features At NEPCON China

During operation, a high precision laser measuring system determines the actual distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modelling and illustrating an altitude profile for the assembly in process. All points of the soldering program are set off against the modelled value, ensuring that all points are soldered at the optimum height regardless of actual board warpage.

The PCB warpage compensation together with the automatic PCB alignment based on fiducial recognition guarantees optimum and highly reproducible xyz positioning, thus going one step further in zero-fault production.

Absolutely unique is SEHO’s AOI feature that can be easily integrated into a PowerSelective, offering remarkable cost savings in floor space and board handling equipment. Depending on the complexity of the products to be soldered, the AOI system can be activated if solder joints are considered to be critical, or it may be deactivated for uncomplicated boards, thus reducing overall production time.

While using the AOI system in the production process, the unit allows separation of assemblies with defects and automatically leads them to a repair station instead of returning them into the production line. The AOI system is equipped with a special 5 MP RGB camera and LEDs for lighting in different colours. It provides a field of view of 51 x 38 mm with 20 µm pixel resolution. The software that belongs to the system provides a comprehensive component library to ensure easy programming.