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PLX Techology Executive to Present at Linley High-Speed Interconnect Conference

16th November 2010

ES Admin

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PLX Technology (NASDAQ: PLXT), a leading global supplier of software-enriched connectivity solutions for the enterprise and consumer markets, today announced that Vijay Meduri, PLX® vice president of engineering, systems, will present on the latest developments in PCI Express® (PCIe®) datacenter strategies at the upcoming Linley Group’s High-Speed Interconnects seminar, in San Jose, Calif. His presentation, titled “PCI Express as a Clustering and Remote-I/O Interconnect” and part of the seminar’s System Interconnects track, will take place Wednesday, November 3, with the program beginning at 9:00 a.m. (PDT).

Meduri’s presentation will address how PCIe delivers compelling system benefits both in terms of performance and cost-effectiveness, while becoming a ubiquitous board-level interconnect in computing, communications and industrial applications. The presentation will explain how, with the advent of PCIe 3.0 (Gen 3) and its astounding throughput potential of multiple GigaBytes/sec*, the technology’s performance-per-watt and low-latency capabilities make it a formidable contender for critical applications that extend PCIe both to the backplane and as a box-to-box interconnect. Additionally, Meduri will cover key innovations in hardware and software that now enable PCIe to become a cost-effective fabric in clustering and remote-I/O applications.