Nordson ASYMTEK at SMT Hybrid Packaging
Nordson ASYMTEK is to present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results in the SmartTec stand at SMT Hybrid Packaging.
Nordson ASYMTEK’s Quantum Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show’s Future Packaging Line at stand 6-434. Demonstrations include the new NexJet 8 and IntelliJet jet valves with the ReadiSet Jet Cartridge. The NexJet 8 handles abrasive fluids, has a long wear life, and dispenses consistent dot volumes for a wide range of fluids used in microelectronics manufacturing.
The IntelliJet is a piezo jet that dispenses small dot sizes at high frequencies without compromising the precision, high yield, and long-term reliability needed for flip chip underfill and advanced semiconductor packaging applications. The IntelliJet advances piezojetting technology with long-term reliability up to 3 times longer than other piezo-driven jets. Both jets use Nordson ASYMTEK’s ReadiSet 2-piece jet cartridge that is fast and easy to clean. Its short fluid path minimizes fluid waste and clogging.