/> It has been more than 10 years since lead-free solders were introduced to the Japanese market. This presentation will report the latest trends in the usage of the Sn-Cu-Ni+Ge lead-free alloy that initially established its reputation in wave soldering. Mr. Nishimura also will discuss developments in halogen-free fluxes.

Tetsuro Nishimura is a graduate in Metallurgical Engineering from Kansai University, Osaka, Japan and joined Nihon Superior Co., Ltd in March 1980 to work in sales, product development and technical support. His work lead to the development and patenting of a low melting point solder, a thermal fatigue resistant solder and, with Takada Pharmaceutical Industries, a no-clean flux.

When the electronics industry started to change to lead-free technologies, Tetsuro developed a tin-copper-nickel-germanium alloy solder that, under the brand name SN100C®, earned the company recognition around the world. Tetsuro’s achievements with Nihon Superior have been recognized with an Intellectual Property Achievement Award from the Japanese Patent Office of the Ministry of Economy Trade and Industry and a Best Company Award in the Osaka Monadzukuri program.