Nihon Superior Shanghai to Exhibit at NEPCON China 2012

While based on the proven SN100C Sn-Cu-Ni technology, which now has a track record of more than 13 years of successful delivery of high productivity and reliability, SN99C has a controlled addition of Ag for enhanced strength and intermetallic stability. In high-speed pull testing of joints reflowed to a copper substrate, its ranking in comparison with other common alloys in terms of fracture energy at pull speeds ≥10 mm/s is: SN99CN>SN100C≥Sn-37Pb>Sn-3.0Ag-0.5Cu. SN100C is a compliant alloy that provides high impact strength and substantial cost advantages.

Also on display will be Nihon Superior’s next-generation range of completely halogen-free solder paste, flux-cored solder wire and liquid flux. While having no deliberate additions of any halogen (F, C, Br or I), these products still deliver excellent reflow and wetting on all common substrates.

Where halogen activation is acceptable, the new SN100C (551CT) flux-cored wire provides a new level of performance with a reduced incidence of icicles in sequential soldering and rework.

SN100C Series
For situations where voiding must be minimized, Nihon Superior has introduced SN100C P810 D4, which has been formulated specifically to facilitate optimum performance of nitrogen atmosphere vacuum reflow systems. While by itself the vacuum reflow process can be effective in achieving a much lower incidence of voiding than conventional reflow processes, its use with the SN100C P810 can further reduce the residual voiding to less than 1 percent of the joint area. This is particularly important in large area joints to components such as QFN where heat transfer has to be maximized. Wetting performance is not compromised and this paste typically can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 solder pastes with a peak around 240°C.

NEPCON China 2012 is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Convention & Exhibition Center