New service gives easy low-cost access to 90nm chip process technology

It will enable these companies to produce from 40 to several hundred chips
while only paying for the proportion of the mask set and wafers that their
devices use.

The 90nm MPW service is supported with easy access to proven design kits and
comprehensive documentation. There are regular wafer runs to minimise
time-to-market and devices can be supplied as wafers, die or assembled parts
in plastic or ceramic packages. Furthermore, partly processed wafers can be
held in stock to enable rapid production of additional chip samples or fast
turn-around of fixes to the metal layers if a re-spin is needed.
Mixed signal designs where power consumption is critical, or where there is
a high degree of complexity and functional integration, can benefit from
moving to smaller-geometry process technologies. Wireless, consumer video
and audio, and high-speed communications are typical applications.

In addition to the IMB 90nm process, MOSIS now also offers MPW services
based on TSMC¹s 130nm process technology.

In Europe, the MOSIS service is exclusively available from EDA Solutions,
based in Southampton, UK.