Analysis

New Scale Technologies names David Simpson vice president of sales and marketing

17th August 2010
ES Admin
0
New Scale Technologies has named industry veteran David Simpson to the newly-created position of vice president of marketing and sales. Simpson has 24 years of experience in sales and marketing of technical products and services. Most recently with New Scale's strategic partner austriamicrosystems, he was instrumental in introducing New Scale's SQUIGGLE micro motor to austriamicrosystems' worldwide direct sales force and distribution network. In this role he drove sales, marketing, engineering and channel activities for the companies' jointly-developed micro-mechatronic systems.
Dave has been a champion of New Scale products within the austriamicrosystems sales network since 2008, and has been a key force in helping sales reps add value to their offerings while dramatically expanding New Scale's global sales reach, said New Scale co-CEO David Henderson. He has proven his ability to leverage global sales channels and build multi-level corporate relationships to sell advanced technical solutions.

With outstanding sales, management and marketing experience, Dave is a very strong addition to New Scale's leadership team.

Simpson has held numerous senior management positions with Fortune 500 as well as start-up companies. He was vice president of North American sales for Harris Corporation's semiconductor division, a $400M business, and director of sales for the Americas at Temic Semiconductor, a division of
Daimler Corporation. He started the collaboration business unit and managed overall operations as vice president of E2open, a start-up provider of cloud-based supply chain management solutions backed by IBM. He has additional experience as co-founder of web-based collaboration start-up WebPRN, vice president of Open-Xchange, and president of IGC LLC.

Simpson has a BS from the State University of New York at Brockport with dual concentrations in Marketing and Finance.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier