Multitest To Present At The European 3D TSV Summit

Bad parts in the stack will corrupt good ones. The worst-case scenario adds a cost-intensive component such as the memory on a stack, which is dysfunctional. The KGD concept can only partly resolve this. Advanced packaging processes not only require total reliability of the overall supply chain, but also require advanced models to reduce the risk of unprofitable output caused by the packaging process itself.

In traditional semiconductor production, component test (for KGD) and final test for ultimate functional QA before shipment is sufficient to ensure quality but also cost-efficiency. Advanced packing methods such as 3D go beyond this. This paper will discuss methods for a distributed test flow, which compares the cost of test with the cost of non-testing with special references to the packaging process. It will also highlight the opportunities and challenges of distributed test strategies and analyse the best models for various test distributions and the specialized equipment requirements.

The theme of the first-ever Summit is “On the Road towards TSV Manufacturing,” a critical issue as device designers and manufacturers increasingly cross into the third dimension as a result of the industry’s continuing pursuit of building more functionality into ever-shrinking silicon “real estate.”

The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production. Business-related aspects of 3D TSV will be addressed.