Analysis
Multitest to Exhibit New Test Solutions at the International Test Conference
Multitest will showcase its leading test solutions in Booth #313 at the upcoming International Test Conference (ITC), scheduled to take place September 18-23, 2011 at the Disneyland Hotel in Anaheim, Calif.
At tBandwidth up to 40 GHz
High power/high current up to 1,000 A
KELVIN contactors
The portfolio includes contacting solutions for:
All handler and probe types
Array and in-line packages
Small-pitch devices down to 0.25 mm
Singulated test, strip test and WLCSP
The company also will highlight its ATE printed circuit board (PCB) design, fabrication and assembly resources dedicated to semiconductor test. State-of-the-art production equipment and Multitest’s long-term experience ensure reliable on-time delivery and industry-leading quality for advanced applications. Captive fabrication and assembly facilities ensure seamless and accurate transition from design to manufacturing and assembly.
Multitest’s test interface and burn-in boards provide the best performance for challenging applications. The test interface and burn-in board product line completes Multitest´s portfolio and offers additional cost savings through advanced burn-in test capabilities that simplify costly final test.
Multitest’s Plug & Yield® program ideally leverages the unique, comprehensive product portfolio and the in-depth understanding of the industry’s needs. Total project management and concurrent engineering as well as engineering and quality control on the system level — rather than on test cell components — result in the best time-to-market, optimum performance of the overall test cell and highest yield.