Analysis
Multitest to Exhibit Integrated Test Solutions at BiTS 2013
Multitest will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ. Multitest combines long-term experience in semiconductor test with the expertise of its specialists and state-of-the-art tools to apply industry-leading methods for optimizing test equipment and interfaces.
The Plug & Yield: As a unique one-stop supplier, Multitest provides the most comprehensive product range – from load boards to test handlers – with an unprecedented depth of solutions within each product group. Multitest Plug & Yield stands for the optimum test setup that is ideally integrated.
Load Boards: Multitest offers full turnkey PCB solutions from design to assembly and specializes in high layer counts, high parallel test and fine pitches. Multitest boards provide significant advantages in reliability and cost of test – at wafer probing, in-process test and final test.
Contactors: Recently, Multitest has even expanded its contactors portfolio and now offers direct pin sales of the ECT ZIP product line as well as the entire catalog of ECT Semicon Probes.
Automatic Contact Cleaning: The ACC (Automatic Contact Cleaning) feature of the Multitest test handlers ideally leverages the broad and comprehensive know-how and process understanding to reduce test cell downtime due to contact cleaning.
Test of 3D TSV packages: Established test processes cannot deal with the risks of assembly 3D packages. New process steps are applied on the ultra-thin wafer in between probing and assembly. Bad parts in a die stack can corrupt good ones before they are discovered during final test. KGDs cannot eliminate the risk.
Requirements of in-process test are going far beyond final test technology. Plug & Yield enables aligned design and optimization of the test cell components to achieve viable, robust and cost efficient solutions.