Analysis
MIRTEC to Exhibit Innovative AOI and SPI Systems during SMT/Hybrid/Packaging 2012
MIRTEC announces that it will showcase its award-winning MV-9 3D Series AOI System alongside a range of other groundbreaking AOI and SPI technologies at its distributor pb tec’s Booth 7:506B during SMT Nuremberg, scheduled to take place May 8-10, 2012 at the Messezentrum in Nuremberg, Germany.
'We Also on display will be MIRTEC’s MS-11 In-Line SPI System which uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 inspects for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New to Europe at SMT/Hybrid/Packaging 2012, the MS-11 will be configured with the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightning-fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-9 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.
Mirtec will also highlight its MV-3 Series Desktop System, the industry’s most widely accepted Five Camera Desktop AOI System. The MV-3 Series features the Intelli-Beam Laser System and is configured with a Top-Down View, Ten Mega Pixel camera. The system also features Precision 9.8 Micron Telecentric Compound Lens and four Ten Mega Pixel Side-View Cameras with a Remote Debugging Function for perfect re-inspection by the operator with 360° images from side on defect