Analysis

mimoOn demonstrates real-time end-to-end LTE on industry leading embedded processors

12th May 2009
ES Admin
0
mimoOn GmbH, a leader in software defined radio solutions (SDR) for advanced wireless standards, today announced a demonstration of end-to-end LTE on the industry leading platforms of Cavium Networks and ARM at LTE World Summit, Berlin, May 18-20, 2009.
mimoOn’s advanced LTE software package mi!InfraSTACKTM runs on Cavium’s OCTEON MIPS64 multicore processor on the infrastructure side, which is connected via a physical layer emulation to an LTE UE mobile implementation by partner Qasara running on an embedded ARM 926 processor. The demo shows live high-definition video being streamed from one end to the other, and execution of a file transfer application. mimoOn and Qasara’s advanced diagnostic tools will be used to demonstrate controlled bearer establishment, security procedures and high speed U-plane data transfer between Qasara’s LTE UE mobile software stack and mimoOn’s eNodeB software stack mi!InfraSTACKTM as specified by the 3GPP standard.

According to mimoOn’s CEO Thomas Kaiser – “This is a significant milestone because until now industry implementations of LTE software have primarily been on PC platforms. This demonstration showcases LTE moving from test systems to final device form-factors that will expedite the rollout of LTE networks, and bring true mobile broadband to the wireless consumer.”

mimoOn’s software family encompasses eNB and UE PHY and Protocol Stack layers, that are full-featured and certified based on the March 2009 version of the 3GPP Standards Release 8 36.XXX series. The software is written in high level language and is in modular form so it is easy to modify or customize even after being deployed - an important feature as the standards for the protocol layers continue to be revised. The implementations on OCTEON and ARM offers high performance, extremely low power consumption, and headroom for the advanced processing required for LTE on both, the base station and user equipment side. This hardware software combination delivers a proven turnkey solution to OEMs that allows fast time-to-market, reduced bill-of-materials, and the ability to evolve with future market requirements.

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier