Microsemi Elected to Lead 'ELCOSINT' Team to Develop Material for High-temperature Electronics Applications

These materials will be suitable for components subjected to extremely high operating temperatures of 250 degrees C or more, which often occur in market sectors such as aerospace and down hole drilling.

The three-year ELCOSINT project is partially funded by the Technology Strategy Board, an executive non-departmental public body established by the United Kingdom government to stimulate technology-enabled innovation. Microsemi will collaborate on the project with the UK's National Physical Laboratory, a world-leading center of excellence in developing and applying the most accurate measurement standards, science and technology available; and Gwent Electronic Materials LTD, a supplier of sophisticated and cost-effective electronics materials.

About the ELCOSINT Project
The multi-disciplinary ELCOSINT project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatible with standard microelectronics manufacturing processes, and replacing high-lead solder with nano-silver based materials will enable improved performance in harsh environments. It is also more environmentally friendly.

A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterization, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.