Microsemi Announces Commercial Off-the-Shelf Up-Screening for Plastic Packaged Products

Up-screened products include MOSFETs, IGBTs and fast recovery diodes listed in the Power Products Catalog (http://www.microsemi.com/literature/PPGCAT.pdf). A standard up-screening flow has been created to assist customers in ordering these devices. All up-screened devices will be ordered using a MXL suffix. Variations to the standard flow are also possible with Microsemi's standard custom process.

Standard up-screening stresses include:

· High Temperature Bake
· Temperature Cycle
· High Temperature Gate Bias (HTGB)
· High Temperature Reverse Bias (HTRB)
· Post Stress Electrical Testing

Many companies today are pursuing the use of plastic devices versus their hermetic counterparts in high reliability applications where keeping costs down is key, said Russell Crecraft, Vice President and General Manager for Microsemi's Power Products Group. This product offering complements Microsemi's existing hermetic offerings and plastic up-screened products.