Microelectronics miniaturisation for OEMs

NEO Tech has the experience and capability to support OEMS which are pushing the technology boundaries of implantable solutions.

Implantable medical device manufacturers make use of NEOTech’s microelectronics capabilities through services such as:

• Miniaturisation by use of microelectronic high density packaging technologies;
• Interactive DFM/DFT;
• Electrical, mechanical, and thermal analysis;
• Development of electrical, functional and environmental tests that support high-reliability manufacturing.

NEO Tech’s medical microelectronics manufacturing sites are ISO13485:2003 certified. Microelectronic capabilities include:

• Wafer & Die Processing
• Die attach using a variety of epoxies and other materials;
• Placement capability of all device types including RF and MMIC devices;
• Automated wire bonding including gold and aluminum wedge, and gold ball bonding;
• Custom microelectronic packaging, including multichip packaging (MCP), multichip modules (MCM), power modules, chip-on-board (COB), chip-scale-modules (CSM).

The microelectronic assembly and test services are carried out in NEO Tech’s cleanrooms. This area, as well as the main production areas, feature complete environmental controls. The company has experience providing microelectronic manufacturing services for a wide variety of implanted medical applications, including:

• Neuro stimulators incorporating high I/O, custom ASIC chip-on-board technology for a high level of integration and miniaturisation;
• Implantable RF transceivers that operate at 400 MHz ISM band for implantable medical device communication and programming;
• Microelectronics for cochlear implants;
• Bion devices used for stimulation and sensing.