Meet Multitest At Teradyne Users Group Conference 2013

15th April 2013

ES Admin

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Multitest has announced that it will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer level test to final test – for standard ICs and sensor packages. Multitest Quad Tech applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, high bandpass and unsurpassed contact integrity.

The architecture is based on a dual-fork design that features a redundant, permanent bias. All surfaces are open and planar and therefore have ideal plating quality. The Quad Tech design is scalable to support fine-pitch applications.

The Triton responds to the dedicated needs of these digital applications, which include servers, computers, mobile smartphones, digital TV and graphics. Typically they feature large array packages, highly integrated devices with high I/O count and many high-speed differential I/Os.

The Triton offers an enhanced compliance window to accommodate stack height variations, an optimized force to support large BGAs and LGAs, and multi-site package test. With up to 20 GHz differential bandwidth, it is ready for the next generation of digital devices. The design of the Triton contactor leverages the advantages of the unique Multitest Quad Tech architecture for high-end digital applications.

Multitest’s leading fab capabilities ensure cost-effective solutions for high layer count and fine-pitch boards. Thoroughly defined processes ensure dependable on-time delivery. Multitest key differentiators are:
-high aspect ratio process
-UltraFlat process
-unique gold plating processes: DuraPad, ENCAP and Direct Attach
-advanced fine-pitch drilling processes
-“flat & smooth” via fill