USB 2.0 technology wins optical inspection system deal
Kurtz Ersa North America has delivered the new ERSASCOPE 2 to ACME PCB Assembly. Superior picture quality, increased light sensitivity and plug-and-play ease of use with USB 2.0 technology were cited as just some of the capabilities that drew ACME PCB Assembly to the ERSASCOPE 2.
The ERSASCOPE 2 uses megapixel, digital USB 2.0 camera technology offering up to 400 percent higher resolution than previous models. Enhanced images allow for increased clarity when zooming to higher magnifications, especially when using the revolutionary flip chip optical lens.
A new metal halide light source offers a brighter white light and a mechanical iris adapter for additional gooseneck lighting with two standard fiber optic light brushes.
“We found that the ERSASCOPE 2 better enables us to find BGA quality issues such as cold soldering or solder peeling than X-ray inspection,” commented Stephen Yun, V.P. of Operations, ACME PCB Assembly. “The ERSASCOPE 2 gives our company another inspection layer to make sure the quality is excellent.”
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