Analysis
Kilopass and UMC Sign Long Term Technology Roadmap Agreement
Kilopass Technology Inc., and United Microelectronics Corporation have jointly announced that they have expanded their existing manufacturing license agreement. In addition to the 40nm low-power process in the current agreement, the extension will cover UMC technology processes spanning from 55nm to 130nm. Future plans include UMC’s 28nm High-K metal gate (HKMG) and Poly/SiOn processes, based upon customer demand. This technology roadmap supports the companies’ mutual customers to achieve leading edge SoCs with Kilopass’ XPMTM, GustoTM, and IteraTM NVM products for a wide range of UMC process nodes.
This“We are pleased to add Kilopass as another member of UMC’s circle of strategic partners,” said S.C. Chien, Vice President of Customer Engineering & IP Development & design Support at UMC. “We see Kilopass’ OTP (One Time Programmable) roadmap, customer adoption, and broad portfolio of unique offerings as convincing factors for an ideal OTP partner for UMC. Their logic NVM solutions will nicely complement UMC’s existing embedded NVM portfolio, which includes eFlash, eE2PROM, eMTP, eOTP and eFuse. We look forward to Kilopass continuing the excellent support it has delivered thus far.”
“I am very excited that Kilopass has won UMC to our anti-fuse NVM technology,” said Charlie Cheng, president and CEO of Kilopass Technology, Inc. “Finally, we have achieved our strategic initiative of covering the broad range of UMC product line so we can be truly successful in greater China, where customers appreciate UMC’s focus on best price/performance and customer-first business approach.”