IPC International academic competition winners to present at IPC APEX Expo 2012

The winning research papers selected were:

Low Temperature Lead-Free Assembly Via Transient Liquid Phase Sintering, by Joseph Flanagan, Purdue University
Measurement Study for Cross Section Versus X-ray Inspection, by Loc Nguyen, San Jose State University
Solder Fillet Height Workmanship Criteria for Castellated Solder Joints, by Tim Pearson, Iowa State University

Open to all accredited U.S. and international colleges and universities with a strong focus on the electronics industry, this year’s competition welcomed entries from around the world. The paper abstracts were judged by an IPC blue ribbon committee.

“It was an extremely difficult decision as all the entries were exceptional,” says Greg Munie, Ph.D., IPC conference director. “I believe the top three selections are innovative and exemplary of the high level of research being conducted at the world’s academic institutions, with great promise as valuable contributions to our industry.”

In addition to being recognized by the industry at IPC APEX EXPO, each winning author will each receive an airfare allowance to travel to IPC APEX EXPO, free hotel accommodations and a free technical conference registration.

Industry professionals may register online for free exhibit hall registration and attend this session and other educational BUZZ sessions. IPC APEX EXPO is the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.