Interconnect offers QSFP28 functionality in SFP form factor

In the coming months, the MSA will define the electrical connector, cage system and module dimensions that will establish this new form factor. To ensure that this system delivers on the goals of broad industry adoption and standardisation, TE is inviting connector manufacturers, optical module makers and communication equipment manufacturers to join the MSA. Direct-attach copper cables, active optical cables and transceivers with MPO and LC optical connections will be supported by the new form factor.

“Customers are looking for a smaller form factor that will offer increased faceplate density and higher aggregate bandwidth, while still maintaining superior thermal performance,” said Nathan Tracy, Technologist, Data Communications, TE. “By defining a standard that provides significant thermal management improvements and increased density over existing form factors in both short and long reach applications, our MSA group will meet those customer needs.”

“As the industry develops the next-gen data centre equipment, there is value in an improved pluggable form factor that can support higher density designs and still meet high bandwidth requirements,” commented Brad Booth, Principal Network Engineer, Global Networking Services, Microsoft. “Thermal management becomes more of an issue as form factors get smaller, and this new MSA is an innovative step to address these design and power challenges.”