Analysis

Intelligent packaging solutions integrate RFID into packages

2nd June 2015
Jordan Mulcare
0

NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions. The development will focus on integrating RFID into packages for consumer engagement and supply chain purposes. The collaboration will also focus on brand protection and the development of tamper evidence applications. These solutions will benefit both consumers and brand owners.

By using NXP RFID technology such as NFC and high frequency, Stora Enso will in the future have smart packages that can be easily tracked and traced through the entire supply chain providing full end-to-end transparency. The integrated technology will also be able to detect if the intelligent package has been tampered with en route to the consumer and, once in the hands of the consumer, can provide additional information and interaction through (the tap of) an NFC-enabled smart phone.

This visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold; the intelligent packaging will be able to verify the authenticity of the product and also provide care, usage and other important information via the NFC-enabled tag.

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