In-Mould electronics set to take off at last

Overall, IDTechEx expects 2017/18 to be the years when IME applications finally grow after years of on and off starts. IME enables the manufacture of structural electronics where the electronics are part of the structure itself. It leads to more elegant space-saving designs where discreet components such as PCBs become redundant, and helps the industry transition beyond the current old-electronics-in-a-new-box approach. This technology is currently best suited to high-volume and low-complexity applications particularly in sectors such as whitegoods and automotive. Note that IME is distinct from MID (Molded Interconnect Devices). In the former, the graphical and functional layers are first deposited (e.g. printed) on a flat 2D surface and then formed into a 3D object; whereas in the latter the 3D object is first formed and then metallized using processes such as LDS (laser direct structuring). The IME process is still relatively immature. The industry had largely been pushed along by material suppliers in search of new market outlets, particularly conductive paste makers. The manufacturing step of the value chain had remained weak and most progress, until recently, had been made at piloting facilities by small- to medium-sized firms.