Analysis
Freescale extends reach of PowerQUICC II Pro architecture with new processors for cost-sensitive networking and industrial applications
Freescale Semiconductor is introducing a new portfolio of cost-effective PowerQUICC II®Pro processors with exceptional performance-to-power ratios and upgraded interconnect technology options. Featuring sub-$10 resale price points, the new MPC830x communications processor portfolio includes the MPC8308, MPC8309 and MPC8306/8306S products, which all offer upgraded high-speed interconnects allowing customers to lower bill of material (BOM) costs for target applications such as line cards, industrial applications, WLAN access points, intelligent NIC equipment, smart energy gateways, and general purpose control functions.
“TAll products in the MPC830x portfolio incorporate the e300c3 (MPC603e-based) core built on Power Architecture® technology, which includes 16 Kbytes of L1 instruction and data caches, IEEE 754 double precision floating point unit, dual integer units and on-chip memory management units (MMUs). The MPC8306/09 devices provide up to 800 MIPS of performance along with high integration and low power consumption, enabling fanless, “green” and low-cost designs.
The MPC830x communications processor portfolio was designed at Freescale’s India Design Center using advanced SoC design methodologies and techniques to achieve quick cycle times from product definition to silicon qualification.
MPC8309 product features
* e300 core running up to 400 MHz
* Single-RISC QUICC Engine™ communications module
* 16/32-bit DDR2 memory controller with ECC support running up to 266 MHz
* Peripheral interfaces such as 32-bit / 66 MHz PCI, 16-bit / 66 MHz local bus interface, USB 2.0 (high speed), x4 CAN, x4 UARTs, enhanced SDHC controller, 5 unified communication protocols to support multiple fast Ethernet / HDLC ports / IEEE® 1588 support
MPC8306/8306S product features
* e300 core running up to 266 MHz
* Single-RISC QUICC Engine communications module
* 16-bit DDR2 memory controller running up to 266 MHz
* Peripheral interfaces such as 16-bit / 66 MHz local bus interface, USB 2.0 (high speed), x4 CAN, x4 UARTs, enhanced SDHC controller, 5 unified communication protocols to support multiple fast Ethernet / HDLC ports / IEEE 1588 support
MPC8308 product features
* e300 core running up to 400 MHz
* 16/32-bit DDR2 memory controller w/ ECC support running up to 266/333 MHz
* Peripheral interfaces such as 16-bit / 66 MHz local bus interface, single lane PCI Express®, USB 2.0 (high speed), enhanced SDHC controller, dual gigabit Ethernet controllers
The MPC830x devices are offered in 19mm x 19mm MAPBGA packages with a 0.8mm pitch, enabling a smaller overall footprint for space-constrained applications while minimizing board routing complexity. Pin counts vary from a 369-pin package for the MPC8308 up to a 489-pin version for the MPC8309. The portfolio’s high level of integration allows customers to lower BOM costs while fulfilling demanding form-factor requirements.