FET Plus Driver Multi-Chip Module for use in high-current synchronous buck applications

By replacing a 12V driver IC and three N-channel MOSFETs, the FDMF8700 saves 50 percent board space compared to discrete component solutions. The layout and size of the switches and driver die are optimized to enable higher-frequency operation and are intended for use in desktop and server VR11.x vCore conversion, high-current DC-DC point-of-load converters and small form factor voltage regulator modules. The FDMF8700 enables designers to maximize footprint power density, reduce component part count/BOM cost and shorten time to market.

“The FDMF8700 FET Plus Driver is specifically designed to achieve an optimum application solution by using components that are matched electrically, thermally and mechanically to the input and output characteristics of each element, leading to superior module performance unattainable any other way,” said Guy Moxey, director of Fairchild’s low voltage market segment. “The FDMF8700 exemplifies Fairchild’s commitment to the computing industry through the development of fully optimized, integrated subsystems delivering higher efficiency, smaller footprint and more functionality, while providing superior performance.”

Unlike discrete solutions whose parasitic elements combined with board layout significantly reduce system efficiency, the FDMF8700 module is designed to both thermally and electrically minimize parasitic effects and improve overall system efficiency. In operation, the high-side MOSFET is optimized for fast switching while the low-side device is optimized for low RDS(on). This arrangement ideally accommodates the low-duty-cycle switching requirements needed to convert the 12V bus to supply the processor core with 1.0V to 1.2V at up to 30A. Fairchild’s MLP 8x8 power package extends the concept of enhanced packaging for DC-DC converter applications. The integrated FDMF8700 module provides an additional efficiency gain of 1.5 to 2 percent for peak- and steady-power levels compared to discrete solutions using D-Pak packaging.

The FDMF8700 is the first product in the new FET Plus Driver Multi-chip Module family. Additionally, Fairchild offers a broad range of DC-DC solutions, including high- and low-side application-specific MOSFETs, multi-phase DC-DC controllers, and buck regulators. Also available are multiple point-of-load devices, including LDOs and integrated switches offering up to 95 percent efficiency.

The FDMF8700 is available in a 56-pin (8 mm x 8 mm) MLP. This lead (Pb)-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect.