Dialog Semiconductor and TSMC collaborate on industry leading BCD process for Power Management ICs

The 0.25-micron high-voltage process node enables higher voltage functionality to be integrated efficiently into single chip power management ICs, increasing cost efficiencies and expanding the addressable market for Dialog solutions.

The ability to integrate higher voltage and more efficient components is an important feature of Dialogs next generation PMICs, and enables the creation of smaller form factor devices with reduced power consumption. A broad range of proprietary IP blocks, based on TSMC's 0.25um BCD process nodes, have already been developed for incorporation into Dialog's next generation PMICs, with the first devices already available. The designs deliver the industry's leading power management performance for portable devices.

Close collaboration for innovative technology with our foundry partners is key to Dialog's strategic business model, which accelerates the development of the highest level of power management integration in the industry, said Dr Jalal Bagherli CEO of Dialog Semiconductor. Through our ongoing and longstanding collaboration with TSMC, we are able to provide our customers with validated low-power technologies to manage their power management needs and meet aggressive time-to-market goals.

TSMC consistently delivers cutting edge technology platforms that include integrated design collaterals, said Jason Chen, Vice President of Worldwide Sales and Marketing at TSMC. Dialog is one of the technology leaders, bringing the best power management experiences possible to portable users through extended battery lifetime in portable devices. We are proud to be a strategic supplier to them.