DEK Takes Latest Technology to FIEE/Electrica Brazil 2011

The exhibition will take place at the Pavilhão de Exposições do Parque Anhembi and visitors can meet with DEK representatives at the Fuji Do Brasil stand, #N26.

At the heart of the DEK exhibit is the Horizon 03iX print platform, which offers SMT specialists the ultimate in future-proofing capability with multiple in-field retrofittable options. The system at FIEE/Electrica will come fully equipped with a suite of productivity tools including Cyclone understencil cleaning technology, HawkEye high-speed print verification capability and paste roll height monitor automatic solder paste replenishment technology -- all powered by the intuitive, operator-friendly Instictiv user interface.

In addition to the Horizon 03iX, DEK and Fuji Do Brasil will treat visitors to demonstrations of DEK’s its most recent technology developments – ProActiv and Nano-ProTek. A ground-breaking new process technology, ProActiv from DEK enables manufacturers to meet the challenges of miniaturization and heterogenous assemblies. With ProActiv on board, ultra fine pitch components can be printed alongside larger components using a traditional print process and a single thickness stencil. Further enabling measurable process improvements, DEK has developed a new stencil nano coating technology called Nano-ProTek, which will also be on hand at FIEE/Electronica. The easy-to-use, wipe-on stencil coating renders the entire stencil surface fluxophobic, thus preventing flux leaching, thereby improving stencil cleaning effectiveness and reducing cleaning frequency.

In addition, show delegates are invited to see DEK’s award-winning VectorGuard stencil technologies, which deliver superior process flexibility through a unique, interchangeable stencil foil system. VectorGuard ensures operator safety, maintains consistent tension throughout the life of the stencil, is reusable and recyclable and available in multiple foil types from standard stainless steel through to electroform.