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Deadline extended for technical conference paper abstracts

30th June 2016

IPC

Daisy Stapley-Bunten

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The deadline of the invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center has been extended by IPC. Professional development courses will take place 12th, 13th, and 16th Februar, 2017 and the technical conference will take place 14th-16th February, 2017. The extended deadline is 8th July, 2016.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognise exceptional achievement, awards will be presented for ‘Best Paper’.

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

3D Printing in Electronics Manufacturing
Automation in Electronics Manufacturing
Adhesives
Advanced Technology
Area Array/Flip Chip/0201 Metric
Assembly and Rework Processes
BGA/CSP Packaging
Black Pad and Other Board Related Defect Issues
BTC/QFN/LGA Components
Business & Supply Chain Issues
Cleaning
Conformal Coatings
Corrosion
Counterfeit Electronics
Design
Electromigration
Electronics Manufacturing Services • Embedded Passive & Active Devices
Environmental Compliance
Graphene in Electronics Manufacturing
Lean Six Sigma
LED Manufacturing
Failure Analysis
Flexible Circuitry
HDI Technologies
Head-on-Pillow
Board and Component Warpage
High Speed, High Frequency & Signal
Industry 4.0
Integrity
Lead-Free Fabrication, Assembly & Reliability
Miniaturisation Nanotechnology Optoelectronics
Packaging & Components • PCB Fabrication
PCB and Component Storage & Handling Performance
Quality & Reliability
Photovoltaics
PoP (Package-on-Package)
Printed Electronics
Reshoring
RFID Circuitry
Robotics
Soldering
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
2.5-D/3-D Component Packaging
Underfills
Via Plugging & Other Protection
Wearables

A 200-400 word technical conference abstract summarising original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasise new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due 8th July, 2016 and course proposals are due 5th August, 2016. To submit an abstract or course proposal, visit the IPC APEX EXPO website.