Cleaning & coating conference announced
The High-Reliability Cleaning and Conformal Coating Conference 2014, which will focus on best practices and technologies for meeting today’s manufacturing challenges and producing reliable hardware, has been announced by IPC and SMTA. The event is scheduled to take place from 18th to 20th November at the Chicago Marriott in Schaumburg, Illinois.
Bill Vuono of TriQuint Semiconductor will chair Session 4 ‘Bottom Termination Components’.
Dale Lee and Dr. Ning Chen Lee, both from Plexus, will present on ‘Design Rules that Reduce Flux Pooling under Component Terminations’ and ‘The Risk of No-Clean Flux not Fully Reacted under Component Terminations’, respectively.
Alongside Linda Woody of Lockheed Martin and Dale Lee of Plexus, Dr. Mike Bixenman of Kyzen will present on ‘Minimum electrical spacing for no-clean flux residue vs cleaned boards (voltage leakage or electro-chemical migration)’.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
