Catalogue presents expanded assortment

The product family of terminal blocks has become much larger, for example in insulation displacement contact technology (IDC) and reversed-gender types, available in the grid spacings 3.81 and 5.08mm. One example of a new item in the board-to-board area is an SMD connection for contacting LED strip PCBs with 1.50mm grid spacing. The communications range is expanded to include the new USB 3.1 Superspeed+ standard. Jack types A and C and wires are available. Short-type modules were also added to the USB 2.0 standard. The family of ZIF connectors has expanded by adding a back-lock version in the 0.5mm grid with a design height of only 1mm.

Two new wire-to-board versions with 2.54mm grid are available for contacting wires on the PCB: the Autocom series as IDC type as well as the Intercom as crimp version for single litz wires with matching male connectors. The new UHS-II standard for SD 4.0 memory cards has produced a new card holder, which is likewise available as a standard product. New fuse holders and miniature key switches have also been developed.