AIM’s Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012

The purpose of this paper is to investigate several factors relating to the families of alloys — both low silver and non-silver. These factors include the use of these alloys as possible replacement alloys in solder paste for component attachment, and the comparison of the paste medium chemistries of these alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock. Other important characteristics that will be addressed include wetting, voiding and HiP mitigation.

In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.