AIM to address Lead-Free Alloy Development at SMTA China South Conference

The presentation titled “Lead-Free Alloy Development” will be held on Wednesday, August 29, 2012 from 11:10-11:40 a.m. in room number 316.

The purpose of this paper is to investigate several factors relating to the families of alloys, both low silver and non-silver. These factors include the use of alloys as possible replacement alloys in solder paste for component attachment as well the comparison of the paste medium chemistries of the alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock. Other important characteristics that will be addressed include wetting, voiding and head-in-pillow mitigation.

Chen is Regional Technical Support Manager for AIM’s Asia Pacific region and has been with AIM for more than five years. Prior to joining AIM, Luke worked at ZTE as an assembly material specialist. He holds a Bachelor’s Degree in Mechanical Design Manufacturing and Automation from Gulin University of Electronic Technology.