Advanced semiconductor packaging company opens HQ in Grenoble

Officially launched in July 2016, UnitySC now occupies 20,000ft², half of which is cleanroom space, and is ready to continue its rapid growth.

“Executing this phase of our vision for UnitySC is a major company milestone,” said Gilles Fresquet, CEO, UnitySC. “Our journey began when we combined the complementary core capabilities of Altatech’s full wafer inspection with FOGALE Semicon’s robust metrology solutions. Basing our operations in Grenoble allows us to support our intensive technology development and tool manufacturing while providing additional capabilities to run customers’ demonstrations.”

UnitySC’s complete portfolio for advanced process control allows all-around and through wafer metrology and inspection for 3D TSV, fan-out wafer-level packaging, wafer thinning, micro bumping, and MEMS, as well as substrate applications. Tools developed by UnitySC combine multiple optical techniques, from UV to IR, based on microscopy, interferometry, spectrometry, full-field profilometry, line scan 2D and 3D confocal chromatic, phase-shift deflectometry, and darkfield Doppler velocimetry. UnitySC customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers and R&D centres.

UnitySC will be exhibiting at the SEMI European 3D Summit, 23^rd-25^th January 2017 at the Minatec Campus in Grenoble.