Analysis
Adeneo Embedded and BEPS Engineering announce collaboration for the Italian market
Adeneo Embedded, a Microsoft Windows Embedded Gold Partner with facilities in Europe and the U.S., and BEPS Engineering, a Microsoft Windows Embedded Silver Partner based in Italy, announced today a collaboration designed to assist OEMs from Italy to achieve the best time to market for their Windows Embedded CE designs.
WithBEPS Engineering, a Microsoft Embedded Silver Partner, provides: products, system buildings, training, consultancy and applications for embedded system solutions. BEPS Engineering also works in close collaboration with Microsoft Innovation Center Turin to promote Windows Embedded technology awareness and expertise among academics and the industry.
Thanks to the agreement between Adeneo Embedded and BEPS Engineering, OEMs from Italy now have a local point of contact for accessing Adeneo Embedded expertise in system integration, BSP customization, drivers and application development in relation to the wide range of microcontroller families supported by Adeneo Embedded. BEPS Engineering will also be able to provide added value services such as on-site consulting, training and support to complement Adeneo Embedded system integration expertise.
“Adeneo Embedded and BEPS Engineering’s business models are quite complementary. As Microsoft Windows Embedded Gold and Silver partners, we bring together a high level of expertise covering the complete design lifecycle for OEMs.” says Yannick Chammings, CEO of Adeneo Embedded. “Being a Worldwide partner of many Silicon Vendors on Windows Embedded, our System integration services combined with BEPS Engineering, local consulting and support services bring complete, end-to-end local support to Italian customers who wish to secure their design in the best time to market.”
”Adeneo’s experience, leading position and complete Windows Embedded expertise allow us to increase our offer strategy to provide our customers with products, system buildings, training and associated services and platform-based development solutions for Windows Embedded” commented Beppe Platania CEO of BEPS Engineering. “Working together, we can provide OEMs with the support, tools, training, services and applications required to fulfill their time-to-market objectives!” he added.
Manoj Rami, Senior Marketing Manager, Microsoft Windows Embedded Business Group, comments: “Microsoft is committed to enabling companies to bring connected embedded devices to market quicker. It is exciting to see our partners collaborating to offer customers even stronger local support. We welcome alliances like this which ultimately help companies better achieve their time-to-market goals.”