Analysis
Interoperability of Tundra’s Scalable Serial RapidIO Switch with TIs New High Performance DSP is announced
Tundra Semiconductor has announced the interoperability of its Tsi578 Serial RapidIO Switch with Texas Instruments' recently announced TMS320TCI6487 and TMS320TCI6488 wireless infrastructure optimized DSPs.
TI's Mike Hames marks 25 Years of DSP Technology at Worldwide TI Developer Conference
The next 25 years of digital signal processing technology will literally integrate hundreds of processors on a single chip to conceive applications beyond our imagination, said Mike Hames, senior vice president, Texas Instruments Incorporated. Addressing electronics industry leaders in his keynote remarks today to open the 5th annual Texas Instruments Developer Conference (TIDC), Hames envisions a world where clothing can alert you of medical pro...
ADSL Modem Chipset from STMicroelectronics Receives Microsoft Approval for Windows Vista Drivers
STMicroelectronics has announced that its highly-integrated Unicorn II USB ADSL (Asynchronous Digital Subscriber Loop) chipset – which enables manufacturers to produce an ADSL USB modem package below the critical €10 level – is the first such product to be offered with drivers for both the 32-bit and 64-bit versions of Windows Vista that have been approved by Microsoft WHQL (Windows Hardware Quality Labs).
Enuclia Picks Tensilica’s HiFi 2 Audio Engine For Flat Panel TV Chips
Tensilica has announced that Enuclia Semiconductor has selected its Xtensa LX processor with the HiFi 2 Audio Engine for its next-generation flat-panel TV integrated circuits. Enuclia is developing chips that produce the best possible picture on analog and digital televisions whether they are displaying standard or high-definition content.
MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007
At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes ...
CML-IT names Farnell its 2006 European distributor of the year
CML Innovative Technologies (CML-IT) names Farnell its European distributor of the year 2006 in recognition of their extremely successful opto-electronics campaign. Farnell introduced a record number of CML-IT solid state lighting products to its product portfolio in 2006.
Lorlin Appoints Saelig As American Technical Sales Office
Lorlin Electronics has announced the appointment of Saelig Co. Inc. of Pittsford, NY, USA as its technical sales agent for North America. Saelig was established in 1988 and has a growing reputation for introducing and supporting unique electronic products to American engineers. It represents and markets products from more than 50 companies worldwide. Saelig's application engineers give US based customers knowledgeable advice for specific appli...
Aerco develops connector for marine survival location device
Aerco's DESIGNSUPPORT team has developed a marine survival location device for Marine Rescue Technologies, the company behind the Sea Marshall range of Man Overboard, Lost Diver and Submarine Escape personal locator beacons.
Miniature diffuse sensors have highly focussed cylindrical beam
New from Contrinex is a range of high power, miniature, rectangular sensors that produces a narrowly focussed, cylindrical light beam that is less than 4mm in diameter and yet has a detection distance of 50mm. This long sensing range with a parallel beam makes possible accurate and reliable detection of objects through small holes and gaps. The sensors can also be used for differentiating between closely aligned or laterally approaching objects...
USB evaluation module provides quick and simple integration into finished products
Future Technology Devices International Limited, (FTDI) has announced the release of its Universal Serial Bus (USB) prototyping module VDIP2. Using its Vinculum VNC1L embedded USB host controller integrated circuit (IC), it is ideal for both the rapid development of VNC1L designs and incorporating into low volume finished products. Supplied to fit a 40 pin DIP header, VDIP2 provides access to all the UART, parallel FIFO and SPI interface pins. Th...