Altus respond to Koh Young’s new inspection system

Launched at the SMTconnect, which welcomed industry leaders from the global electronics community, Meister Model S was central on Koh Young’s stand and drew much attention from visitors at the show.

Building on the popular range of inspection platforms in both AOI and SPI processes, the Meister is the industry’s leading inspection system for advanced packaging and semiconductors. The new Meister S model includes a 3.5 µm pixel resolution and a 25 MP high speed camera.

Anthony Oh, Technical Applications Manager, Altus said: “The reaction to the new Meister S at SMTconnect, and since returning from the show, has been extremely positive. The new S Model was developed to meet the demand for Wafer-Level-Packaging applications.

“Koh Young reported that the average bump size of 70 µm will decrease to 50 µm in the near future. To meet the impending demand, Meister S was developed with a new camera optimised for high-speed image acquisition in a 24/7 production environment. The system also includes an updated lens system. It is an impressive addition to the AOI line-up and we predict it will be a popular choice for our customers this year.

“Any addition to Koh Young’s equipment portfolio is very welcome by the Altus team. As a world-class leader in 3D measurement-based inspection solutions, we know that their new system will be of the highest quality and a sound investment for our customers.”