News & Analysis
Microchip Technology opens Design Centre in Eastern Europe
Microchip Technology has announced the inauguration of a new state-of-the-art Design Centre in Bucharest, Romania. The new centre was opened on 17th April by Microchip’s Chief Executive Officer, Steve Sanghi, and Microchip has initially recruited 15 staffers, with a total of 30 jobs planned by the end of 2008 and 100 over the next four years. The new centre forms part of Microchip’s worldwide network of Design Centres located in India, Switz...
Hendon Semiconductors is new name for IES
Integrated Electronic Solutions, an Australian based IC design and manufacturing company recently announces a new trading name for their semiconductor division. “The new name, Hendon Semiconductors will provide an improved image and focus for our drive to be recognized as a leading supplier in our specialist integrated circuits markets”, said IES Managing Director, Brenton Scott.
TI Makes ZigBeeT Available for Mass Market with Free Software Stack
Texas Instruments has announced the release of their industry leading ZigBeeT stack, Z-Stack, for free download at www.ti.com/zigbee. Z-Stack has been awarded the ZigBee Alliance golden unit status by the ZigBee test house TÜV Rheinland and is used by thousands of ZigBee developers worldwide. Z-Stack is compliant with the ZigBee 2006 specification and supports multiple platforms including the CC2430 System-on-Chip solution for IEEE 802.15.4/...
picoChip powers Axiom multi-protocol femtocell architecture
Axiom Wireless has announced its new “One Phone Service Enabler” product family. This complete system architecture includes the ACF-400 switch and two femtocells: the A-Pro2100 for WCDMA (HSPA) and the A-Pro3500 WiMAX. This is the first WiMAX femtocell, and the first femtocell architecture expressly designed to integrate different wireless standards, starting with these but adding more. With the One Phone Service Enabler, carriers will be ...
New metal housing option for electronics module
Penny + Giles has launched a new metal enclosure option for its electronics module, EICT-M. The module, which performs the signal conditioning for the company’s popular in-cylinder (ICT) and sealed linear transducers (SLT), is now available with a rugged die-cast aluminium alloy housing, suitable for harsh environmental conditions and electrically noisy applications. It was developed in response to customer demand and allows OEMs to install...
Sealed linear transducer for rugged industrial applications
Penny + Giles has launched a contactless sealed linear transducer that provides reliable, fit-and-forget position sensing for rugged industrial applications. The robust SLT190 is aimed primarily at the off-highway (construction, agriculture) and utility vehicle markets and is suitable for the harsh conditions of steering position applications, lift mechanisms, and hydro-pneumatic active suspension systems. This transducer has a short body to stro...
Datasheet describes range of high performance FFT cores
RF Engines Limited (RFEL), the supplier of high performance FPGA-based design solutions, now has available a new datasheet on its ‘HyperSpeed’ range of high-performance FFT cores on its website www.rfel.com. The cores are factory scalable in terms of transform length and processing parallelism and can be built to optimally process complex data streams with very high sample rates from 400MS/s to several GS/s. The cores use a parallel p...
Peter Schmidt becomes Tundra's Director of European Sales
Tundra Semiconductor has announced that Peter Schmidt has been appointed Director European Sales, effective immediately. Tundra continues to grow its customer base in the European communications and computing storage markets and is committed to being aligned geographically with customers and to providing the best support and products for their ongoing success.
TI Goes Beyond 3G with New LTE Offering for Wireless Market for OEMs
As Wideband Code Division Multiple Access (W-CDMA) deployments continue to expand worldwide, Texas Instruments is now looking beyond 3G - to Long Term Evolution (LTE). An initiative of the Third Generation Partnership Program (3GPP), LTE encompasses higher data rates and flexibility in frequency allocations needed to support IP-based applications set to deploy between 2008 and 2012. In order to accelerate original equipment manufacturers' (OEMs) ...
Rugged and waterproof PC for harsh environments
Review Display Systems Ltd has introduced a compact rugged PC system sealed to IP67 for applications where dust and water and a shortage of space present real problems for the systems designer. The AEC-6710 is housed in a rugged aluminium chassis measuring just 165mm x 65.6mm x 197mm. The unit meets Mil-Std-810F for storage and vibration; it also has an operating temperature range of minus fifteen to plus sixty degrees centigrade.