News & Analysis

FIRST (For Inspiration and Recognition of Science and Technology), a nonprofit organisation inspiring young people to be science and technology leaders, has selected the National Instruments CompactRIO embedded control platform as its next-generation FIRST Robotics Competition (FRC) robot controller. With this platform, high school students will create advanced robots starting in the 2009 FIRST season. Students can program their robots based on C...

HARTING has introduced a new industrial Gigabit Ethernet switch, the eCon 2050-AA, which allows the connection of up to five Gigabit Ethernet ports in a very small space.

Anglia has announced that it has signed an agreement to inventory and distribute the PHOENIX CONTACT product range in the UK and Ireland.

The need for miniaturization, increased reliability and operation at elevated ambient temperatures has driven the development of ceramic based substrates and packages for electronics. Due to rising demand KOA offers foundry services to their customers to provide LTCC substrate solutions for various applications. LTCC stands for “Low Temperature Co-Fired Ceramic”.

The MOST FORUM is inviting interested parties to attend its first international conference and exhibition on MOST Technology, on September 30th, 2008. This one-day industry event on infotainment technology will take place in Stuttgart, Germany, presenting the latest and future technologies and applications based on MOST.

Electronics packaging specialist Schroff has introduced a new co-ordinated service strategy designed to ensure that customers enjoy comprehensive support throughout the entire life cycle of the company’s products.

APT is pleased to announce the international release of Opto Diode Corporation’s ODA-5W-100k which combines a high responsivity 5 mm² active area silicon photodiode with a low noise preamplifier with 100 kOhm transimpedance gain.

Kenet Inc., a fabless semiconductor company based in Woburn, Massachusetts, announced today that it has appointed Link Microtek of Basingstoke as its UK representative.

ARM and Synplicity®, Inc., a leading supplier of innovative IC design and verification solutions, today announced the availability of ARM IP through Synplicity’s ReadyIP Program. The ReadyIP program facilitates a vendor-independent design flow using Synplicity’s industry standard FPGA synthesis and system design environments, giving designers easy and secure access to the ARM® Cortex™-M1 field programmable gate array (FPGA) processor fo...

IAR Systems has announced an agreement with the Wireless Connectivity Group of Freescale Semiconductor to include IAR Systems development tools and debug probe in the next generation of Freescale’s development kits based on the MC1322x IEEE® 802.15.4 Platform-in-Package™ (PiP) IC. Freescale’s BeeKit™ Wireless Connectivity Toolkit, which also is included in the kits, provides direct support for IAR Embedded Workbench, easing the integrat...