News & Analysis

Expanding its executive team with the talented leadership required to take the company into its next phase of growth, Tensilica, Inc. today announced it has appointed Dr. Jack Guedj, Ph.D. as the company’s president and chief executive officer (CEO). Guedj has extensive experience as a senior executive with a variety of fast-growing start-ups and high-profile semiconductor companies focused in high-performance communications and multimedia. He ...

With its new transmitter optical sub assembly (TOSA) series Mitsubishi Electric has developed four 1.3µm band laser modules for optical transmission at speeds of 10Gb/s and, respectively, 8Gb/s. Each individual module fits into an enhanced 8.5 and 10 Gigabit small form factor pluggable module (SFP+) measuring just 13.3mm x 13.4mm x 56.5mm. Compared to XFP (10 Gigabit small factor pluggable module) the SFP+ compliant transceivers are 60 percent...

Inertial Aerosystems has announced the addition of four new sensors to their range of precision tilt sensors. Manufactured by U.S. based Applied Geomechanics the ceramic sensor enclosure design delivers much improved stability, repeatability and robustness, at lower cost.

congatec AG has announced that it has extended its COM Express product family with its highest performance module, the conga-BM45. The new module features the latest Intel Core 2 Duo processor, T9400, with a core speed of 2.53 GHz, 6 MByte L2 cache and up to 8 GByte fast, power-saving DDR3 memory. The conga‑BM45 utilizes the powerful Mobile Intel GM45 Express chipset with integrated Mobile Intel Graphics Media Accelerator 4500MHD (Intel GMA...

Peregrine Semiconductor Corporation and MagnaChip Semiconductor Ltd., a leading Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, today, announced that the final qualification phase has begun in the process technology transfer of Peregrine’s UltraCMOS SOS (Silicon-On-Sapphire) technology to MagnaChip’s Cheongju wafer manufacturing facility.

Vishay Intertechnology has released the industry’s first series of high-intensity white power SMD LEDs in the CLCC-2 flat ceramic package. The robust and light-efficient VLMW82.. devices offer low thermal resistance of 20K/W and high optical power from 9000mcd to 18000mcd for thermal-sensitive applications.

Tensilica has announced that Triductor Technology, of Santa Clara, CA, and Suzhou, China, has signed a second license for the Diamond Standard 212GP general-purpose processor core and has completed a second design tape out. Triductor has used the Diamond 212GP processor as the system controller for VDSL2 design for both the customer premise (CPE) and central office (CO) designs. The Diamond 212GP is an area-efficient, low-power, fully synthesizab...

National Instruments UK & Ireland has recently promoted Sarah Brady to Field Sales Engineer for East Midlands and the North East. In her new role, Sarah, who now lives in Sheffield, South Yorkshire, will be the first point of contact for customers in the East Midlands and the North East, with responsibility for specifying systems and introducing National Instruments innovative hardware and software.

Texas Instruments has announced that Steve Anderson has been appointed to a senior vice president position, leading the company’s new Power Management strategic business unit. The new Power Management organization is part of TI’s analog business strategy to better focus on solving customers’ analog, power management and energy efficiency design challenges.

Texas Instruments and Beijing Xinwei Telecom Technology Co., Ltd. (Xinwei) today announced that its next generation McWiLL/SCDMA macro base stations will enable millions of Chinese households to receive voice and data traffic at exceptional speeds, while lowering the cost of deployment for the country’s service providers. By leveraging TI’s 3GHz, powerful multicore DSPs, optimized software and analog signal chain components, Xinwei ca...