News & Analysis
Fairchild Semiconductor Receives Assodel's Best Semiconductor Vendor Award
Fairchild Semiconductor has been awarded the Best Semiconductor Vendor in Italy for 2009 from Assodel. This award recognizes companies that show continued commitment and proactively strive to develop partnerships with distribution partners. This is the second year that Fairchild has been recognized by Assodel, receiving the Best Manufacturer Award in the power category for 2008.
System-on-Chip from STMicroelectronics Simplifies Multimedia Monitor Design and Enhances Viewing Experiences for Consumers
STMicroelectronics has combined a DisplayPort 1.1a and HDMI 1.3 receiver to support full-high-definition sources, such as Blu-Ray, while providing comprehensive analog-video and audio connectivity. The new STDP8028 SoC from ST simplifies the design of high-end Full-HD multimedia displays with its unique integration of video inputs, advanced video quality and usability features such as Picture-In-Picture (PIP) and Picture-By-Picture (PBP). The SoC...
Intersil and the Georgia Institute of Technology announce joint alliance for high-performance semiconductor development
Intersil, a world leader in the design and manufacture of high-performance analogue and mixed-signal semiconductors, today announced a broad alliance with the Georgia Institute of Technology. The announcement includes the opening of a major new development facility and the kick-off of several new programs dedicated to the research and development of advanced power management semiconductor technologies.
Versatile microwave hybrid devices can be used as combiners or dividers
RF and microwave component specialist Link Microtek has added a range of general-purpose 90-degree hybrid devices to its LYNX portfolio of microwave components, which provide a reliable yet low-cost non-ITAR alternative to more established product lines.
Toshiba expands European ASIC offering with eFUSE memory macro
The ASIC and Foundry Business Unit at Toshiba Electronics Europe (TEE) has announced that European ASIC and system-on-chip (SoC) customers can now take advantage of eFUSE (electrical programmable fuse) technology when developing ICs based on Toshiba processes.
Synopsys unveils 30 percent smaller area, low power USB 2.0 PHY IP for 28nm processes
Synopsys, Inc has announced the addition of the new DesignWare USB 2.0 picoPHY IP to its USB 2.0 PHY IP product line that has been successfully deployed in more than 300 customer designs, and in more than 50 different process technologies ranging from 180nm to 32nm. Targeted at mobile and high-volume consumer applications such as feature-rich smartphones, mobile internet devices and netbooks, the DesignWare USB 2.0 picoPHY supports advanced 28nm ...
Napatech Announces Winpcap Support
Napatech recently released WinPCAP support on its intelligent real-time network adapters. WinPCAP is an additional feature to the previously released Windows driver, believed to be the world’s fastest Windows driver for Ethernet applications. The same packet capture feature set and high performance can now be supported across Windows, Linux and FreeBSD.
New Integral Optics facility now completed
Hamamatsu Photonics K.K. has announced that construction of their new building for the development of portable products which combine optical systems with photonic devices is now completed. The new facility, called the “Business Promotion Project Building,” is located on the grounds of the company’s Central Research Laboratory. The completion ceremony was held on the 16th October 2009 and operations will begin in November 2009.
Acal Proposes Acquisition Of Bfi Optilas S.A.S.
Acal has announced that it has agreed to acquire the entire issued share capital of BFi OPTiLAS (the “Acquisition”). BFi OPTiLAS is a private specialised distributor of electronic and photonic components, modules and systems across Europe, as well as supplying value-added calibration and maintenance services. BFi OPTiLAS will be acquired for a consideration of €10 million payable in cash and 2 million Acal ordinary shares to be issued on co...
Maxwell Technologies'Q3 Financial Results Press Release, Conference Call and Webcast Set for November 3
Maxwell Technologies will issue its financial results news release for the third quarter ended September 30, 2009, at 4 p.m. (Eastern Standard Time) on November 3, 2009. Management will conduct a conference call and simultaneous webcast to discuss third quarter results and the future outlook one hour later, at 5 p.m. (Eastern Standard Time).