News & Analysis

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, and the Institute of Nanotechnology (IoN), a professional membership organisation for the nanotechnology industry, has announced its collaboration that with the support of Technology Strategy Board funding, will encourage and support global business development for UK SMEs.

Cypress Semiconductor and TPACK, an industry-leading provider of ICs that provide core data transport and switching functions, today announced a reference design for ultrafast Ethernet switches and queue management applications. The new Springbank reference design combines TPACK’s TPX4004 high-capacity integrated packet processor and traffic manager with Cypress’s CY7C15632KV18 72-Mbit Quad Data Rate™II+ (QDR™II+) SRAMs, offering the fast...

Intel and RealVNC have collaborated to embed VNC remote control technology in the all new 2010 Intel® Core™ vPro™ processor familyto provide IT professionals with a built-in, fully graphical remote control capability to facilitate problem diagnosis and resolution.

Imagination Technologies, the leading multimedia chip technologies company, reports that POWERVR, its hardware graphics acceleration technology, has become the standard for mobile and embedded gaming. POWERVR now has an installed base of over 250 million devices across the mobile phone, media player and embedded markets.

Minicom Advanced Systems, a leading developer of IT & KVM remote access and management solutions, welcomes PDI, a manufacturer of electrical equipment for computer data centers, industrial and commercial buildings, and alternative energy applications to the Data Center Alliance (DCA.).

Dialog Semiconductor has announced its power management ICs have been designed into a series of Sharp 3G cellphones. The first of which, the Sharp AQUOS SHOT 940SH, is available now from the Japanese network operator, Softbank.

Murata Elektronik GmbH has become a Manufacturer-member of the German chapter of AIM, the worldwide industry association for Automatic Identification and Mobility. Representing automatic identification and mobility technology solution providers, AIM has led the way in industry standards, education and outreach since 1972.

COMPRION’s product range supporting the Third Form Factor (3FF) has been extended by a new Mini- UICC Adaptor and new Flex Adaptors. Since 2006 COMPRION offers Test (U)SIMs in the smallest available card format following ETSI TS 102 221. The 3FF SIM card, also known as Mini-UICC or MicroSIM, is half the size of SIM cards today.

Synopsys and the Belgian nanoelectronics research center, imec, today announced they have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterising and optimising the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies.

SiTel Semiconductor today announced how its successful collaboration with Target Compiler Technologies led to the creation of customized audio DSPs for its SC14452 Green VoIP processor. The DSPs combine extreme energy efficiency with high processing performance, enabling industry-leading audio quality and power consumption. Key components of the SC14452 that won a 2009 Frost and Sullivan Green Excellence Award, the DSPs were developed using Targe...