ST's 3-Axis Accelerometers feature small form factor and low power consumption

ST��s new 3-axis motion sensors represent a significant step forward in product miniaturization. Developed in-house, the 3x5x0.9mm plastic package perfectly meets the space and weight constraints in mobile phones and other portable electronic devices. The new accelerometers deliver high performance at low power consumption (1mW) and their ultra-compact robust design
provides very high immunity to vibration and shock survivability up to 10,000g.

From analog products with embedded features to smart sensors with digital interface, the broad-range LIS302 series addresses different system needs and hardware characteristics in a wide range of low-g applications, from hard-disk drive protection to intuitive man-machine interaction in consumer
applications.

ST’s LIS302DL is the first sensor on the market with a standard SPI/I2C digital interface and two independent programmable interrupt signals. The two separate signals make it possible to monitor the end device for ‘free fall’ and ‘high-g motion’ states at the same time. Alternatively, both signals can be used for either state at two different thresholds, for example to distinguish between free fall and rolling. This gives manufacturers more freedom and flexibility in the application design and configuration.

The second device, the analog-output LIS302ALB sensor provides separated acceleration values for all three (x, y, z) axes, as well as a multiplexed signal. The embedded 3-to-1 multiplexer saves costs and space on the board, as well as reduces the layout risks inherent in multiple analog nets.

ST’s new LIS302 accelerometers are suitable for a wide range of applications, including free fall detection for hard-disk data protection, vibration monitoring and compensation, anti-theft and vehicle navigation systems, and motion user interfaces in mobile and gaming devices.

“ST began making MEMS devices for the high-volume consumer market with a broad family of multi-axis motion sensors in low-cost QFN packages, measuring 7x7x1.8mm, and was also the first to develop two plastic LGA packages, with dimensions of only 7x5x1 and 5x5x1.5mm, which are in high-volume production today,” said Benedetto Vigna, General Manager of ST’s MEMS Business Unit. “Now, the LIS302 family, with its 3x5mm footprint and 0.9mm thickness, represents the new LGA generation of ultra-compact 1mW-power-consumption smart accelerometers. Available in analog or digital
type devices, they provide not only a voltage or bitstream, but also simple-to-use interrupt signals.”