Mixed Signal/Analog
ST's Digital Audio SoC delivers 2x20W in 2.57mm x 3.24mm
STMicroelectronics has today announced the most power dense single-chip digital audio system available, the STA333IS. Delivering up to 2x20W of audio output power, the STA333IS has a tiny footprint measuring just 2.57mm x 3.24mm. Combining advanced process and chip-scale package technologies with digital audio IP such as ST’s proprietary FFX full flexible amplification, this new digital audio SoC extends ST’s SoundTerminal family.
OnlyDelivering superb audio quality, outstanding thermal efficiency and low electromagnetic emissions, the STA333IS has a tiny 8.3mm2 footprint which provides design engineers with the extra freedom needed to style new generations of audio products.
Operating without an external microcontroller, the STA333SML variant for “micro-less” applications enables designers to create digital amplifiers with the lowest cost of ownership.
Samples and production quantities of the STA333IS and STA333SML are available now as 5x6-bump 0.5mm-pitch Chip-Scale Package devices. Prices start from $1.00 for orders over 1,000 pieces.
Key Features
-Wide-range supply voltage (4.5 V - 20 V)
-2 channels of ternary PWM (stereo mode)
-2 channels of 24-bit FFX
-100 dB SNR and dynamic range
-Selectable 32- to 192-kHz input sampling rates
-Digital gain -80 dB to +48 dB in 0.5 dB steps
-Software volume update
-Individual channel and master gain/attenuation
-Individual channel and master software and hardware mute
-Independent channel volume bypass
-Automatic zero-detect mute
-Automatic invalid input detect mute
-Short-circuit detection at startup (Out-Vcc, Out-Gnd, Out 1b-Out 2a)
-2-channel I2S input data interface
-2 Hz DC cut filter (input)
-Input channel mapping
-Automatic volume control for limiting maximum power
-96 kHz internal processing sampling rate, 24-bit precision
-Advanced modes for AM interference frequency switching and noise suppression
-Embedded thermal-overload and short-circuit protection